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The advent of 3G technology opens up a wide range of multimedia applications in mobile information
appliances. The LH7A404 is designed from the ground up with a 32‑bit Arm922T™ Core to provide high
processing performance, low power consumption, and a high level of integration. Features include 80 kB
on-chip SRAM, fully static design, power management unit, low voltage (1.8 V Core, 3.3 V I/O) and
lead-free solder formulations have different reflow temperatures than leaded-solder formulations. When using
both solder formulations on the same PC board, designers should consider the effect of different reflow
temperatures on the overall PCB assembly process. Refer to www.nxp.com for an
application note on recommended SOT1021-1 soldering practices.