DEVICE MIGRATION
Generic Copy

ISSUE DATE:	09-Mar-2015
NOTIFICATION:	16630
TITLE:	33907x and 33908x Power System Chip Device Migration with Copper Wire and Design Change
LAST BUY DATE:	30-Dec-2015
LAST SHIP DATE:	30-Dec-2016

DEVICE(S)

MPN	REPLACEMENT MPN	REPLACEMENT TYPE	REPLACEMENT REASON
MC33907AE	MC33907AE Replaced BY MC33907NAE	Same Form, Fit & Function, Pin-for-Pin Equivalent	Design Change
MC33907AER2	MC33907AER2 Replaced BY MC33907NAER2	Same Form, Fit & Function, Pin-for-Pin Equivalent	Design Change
MC33908AE	MC33908AE Replaced BY MC33908NAE	Same Form, Fit & Function, Pin-for-Pin Equivalent	Design Change
MC33908AER2	MC33908AER2 Replaced BY MC33908NAER2	Same Form, Fit & Function, Pin-for-Pin Equivalent	Design Change

AFFECTED CHANGE CATEGORIES

BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)

DESIGN CHANGE

DESCRIPTION OF CHANGE

Freescale Semiconductor announces the device migration of 33907x and 33908x Power System Basis Chip with High Speed CAN family associated with this notification. The replacement parts introduce Copper (Cu) wire as a wirebond material, along with Hitachi CEL 9240HF16FL mold compound and incorporates new functionalities like LIN transceiver and enhanced I/O monitoring for safety compliance.

These products are now qualified for assembly at Freescale Tianjin Final Manufacturing (TJNFM) site, Tianjin China. These products were previously assembled with Gold (Au) wire and Hitachi CEL9220HF10MK1 mold compound at Freescale Tianjin Final Manufacturing (TJNFM) site, Tianjin China.

These new parts are backward compatible to the original parts and do not impact the form, fit, or reliability of the device. Function is improved and device is fully compatible. Customers should begin planning for conversion based on the last order date and last ship date listed above. The replacement devices listed in this notification are the recommended replacement parts in all applications.

REASON FOR CHANGE

The transfer from Gold to Copper wire and new die design are required to mitigate against raw material cost increases and performance enhancements.

ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

There is no impact on device form, fit or reliability. Function is improved with the addition of LIN and I/O monitoring. The device is software and hardware compatible.

Freescale will consider specific conditions of acceptance of this change submitted within 30 days of receipt of this notice on a case by case basis. To request further data or inquire about the notification, please enter a Service Request.

For sample inquiries - please go to www.freescale.com

QUAL DATA AVAILABILITY DATE: 01-Dec-2014

QUALIFICATION STATUS: COMPLETED

QUALIFICATION PLAN:

N/A

RELIABILITY DATA SUMMARY:

N/A

ELECTRICAL CHARACTERISTIC SUMMARY:

N/A

CHANGED PART IDENTIFICATION:

N/A

SAMPLE AVAILABILITY DATE: 01-Dec-2014

ATTACHMENT(S):
External attachment(s) FOR this notification can be viewed AT:
16630_Power_System_Basis_Chip_CAN_Qualification_Results.pdf
16630_Power_System_Basis_Chip_CAN_Delta_Qualification_Matrix.pdf
16630_Power_System_Basis_Chip_CAN_Design_Changes_Communication_Package.pdf
16630_Power_System_Basis_Chip_CAN__CofDC_Compare.pdf